Labels Milestones
BackSocket 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST.
- Card connector, polarization inverse (https://multimedia.3m.com/mws/media/22424O/3mtm-cf-card-header-type-i-low-profile-surface-mount-ts0747.pdf Compact Flash.
- Ovals PCB layout: [front](Docs/precadsr_layout_front.pdf.
- -9.020897e+01 9.940098e+01 4.255000e+01 vertex -9.435317e+01 9.365127e+01 4.255000e+01.
- 1.288822e-001 2.244911e-001 9.659157e-001 vertex 5.307554e+000 -3.062540e+000 2.495400e+001.