Labels Milestones
Back22-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of MSOP-16.
- SWPA5040S, 5.0x5.0x4.0mm, https://www.sunlordinc.com/UploadFiles/PDF_Cat/20120704094224784.pdf Inductor.
- Mount, (http://www.molex.com/pdm_docs/sd/732511150_sd.pdf Molex SMA RF Connector, Edge.