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Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 32 Pin (https://www.ti.com/lit/ds/symlink/ads127l01.pdf#page=87), generated with kicad-footprint-generator LED SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 32 pins, through hole 2.7mm, height 8, Wuerth electronics 9774060960 (https://katalog.we-online.de/em/datasheet/9774060960.pdf,), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (4mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://cache.freescale.com/files/shared/doc/package_info/98ASS23330W.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 14-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://www.monolithicpower.com/pub/media/document/MPQ2483_r1.05.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST , Slide, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row.

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