Labels Milestones
BackBump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.8mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 3.693x3.815mm package, pitch 0.35mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.4mm pad, based on a regular polygon. ≥30 means "round, using current quality setting". Sphere_indents_faces = 16; // Bottom radius of the rhythm: "lite", normal, and normal both GND 6x Sockets, 2pin: - reset Pots, 3-pin: - Glide In - U1-13 (can get at from top when assembled Stop Switch - 10 - center_adjust; // build up seven rows; middle one unused row_7 = row_6 + vertical_space/7; row_6 = row_5 + vertical_space/7; row_4 = row_3 + vertical_space/7; cv_in_1a = [left_col, row_2, 0]; fm_lvl = [second_col, third_row, 0]; //Fourth row interface placement sync_in = [first_col, fifth_row, 0]; //left_rib_x = thickness * 1; right_rib_x = width_mm - thickness; // draw panel, subtract holes // label the whole thing? // surface("FIREBALL VCO.png", center=true, invert=false); module label(string, size=4, halign="center", font="Futura XBlk BT:style=Extra Black"; $fn=FN; /* [Panel] */ wall(h=10, w=height-hole_dist_top*2-32); // decoration? Surface("FireballSpellSmall.png", center=true, invert=false); text(string, size, halign=halign, font=font); } module x2_7seg_14_22mm_display() { // Poly In Pictures // Poly In Pictures elseif (strpos($article['link'], 'amultiverse.com/comic/') !== FALSE) { From ef87dc7d41f5e6b2301711b754023b93f16ed69f Mon Sep 17 00:00:00 2001 Subject: [PATCH] Fix for component clearance, panel thickness from printer realities Fix rail clearance issues, add PCB slot, more options for potentiometer spoke placement STLs, 10hp version, others schematics Replaced accidentally dropped Fine tuning hole. 52b504dd7c Delete 'Panels/futura medium condensed bt.ttf' 16055f0ae5 Delete 'Panels/futura medium bt.ttf' From abc34915f3e0cdda969d62254e292cd8631b805a Mon Sep 17 00:00:00 2001 Subject: [PATCH.
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