Labels Milestones
BackDSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip THT 2x18 2.54mm double row Through hole straight socket strip, 1x40, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x40, 1.27mm pitch, 4.4mm socket length, single row Through hole angled socket strip THT 1x18 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x27 1.27mm single row Surface mounted pin header SMD 1x29 2.00mm single row Through hole pin header THT 2x20 2.54mm double row Through hole pin header THT 1x16 2.00mm single row style2 pin1 right Through hole socket strip SMD 1x30 2.00mm single row style1 pin1 left Surface mounted socket strip SMD.