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9774130960 (https://katalog.we-online.de/em/datasheet/9774130960.pdf,), generated with StandardBox.py) (https://www.bourns.com/data/global/pdfs/SRP5030T.pdf Shielded Power Inductor, Wuerth Elektronik, WE-PDF, SMD, https://katalog.we-online.de/pbs/datasheet/7447797022.pdf Choke Shielded Power Inductor WE-PD2 TypMS Wuerth Power Inductor, Wuerth Elektronik, WE-PD4, SMT, Typ XL, https://katalog.we-online.com/pbs/datasheet/744776012.pdf Choke Power Inductor Fixed inductor Neosid, Power Inductor, body 17x22mm, https://www.we-online.com/catalog/en/WE-HCFT#/articles/WE-HCFT-2012-ROUND Shielded High Current Power Inductor WE-PDF Wuerth Handsoldering L_Wuerth_WE-TPC-3816 StepUp generated footprint, https://www.infineon.com/cms/en/product/packages/PG-LLGA/PG-LLGA-5-1/ AKM Current Sensor, 7 pin, SMD (http://www.akm.com/akm/en/file/datasheet/CQ-236B.pdf akm current sensor tht AKM Current Sensor, 7 pin, THT (http://www.akm.com/akm/en/file/datasheet/CQ-236B.pdf akm current sensor smd AKM VSOP-24 current sensor, 6.5x8.1mm body, 0.95mm pitch (http://www.akm.com/akm/en/product/detail/0009/ Allegro MicroSystems, CB-PSF Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro Microsystems SIP-4, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic Micro Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 44 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (https://resurgentsemi.com/wp-content/uploads/2018/09/MPR121_rev5-Resurgent.pdf?d453f8&d453f8), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (https://datasheet.lcsc.com/szlcsc/Realtek-Semicon-RTL8211EG-VB-CG_C69264.pdf#page=77), generated with kicad-footprint-generator ipc_dfn_qfn_generator.py LFCSP, 20 Pin (http://www.ti.com/lit/ds/symlink/cc1101.pdf#page=101), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 10-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 2mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 48 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 32 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 24 leads; body.

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