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Flatpack No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad.

• -8.88682 0 5.07603 vertex 8.71606.
• GMSTB_2,5/12-GF-7,62; number of pins: 11; pin pitch: 3.81mm.
• Diameter7-5mm, Amidon-T25 L_Toroid Horizontal series Radial pin pitch.

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