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506CN (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic DFN (1.3mm x 1.2mm DFN, 8 Pin (https://www.ti.com/lit/ds/symlink/ina333.pdf#page=30), generated with kicad-footprint-generator JST J2100 series connector, 501331-0207 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xx-DV-TE, 30 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 5273-08A example for new mpn: 39-29-4069, 3 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated.

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