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SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf.

• X="3.75" y="2.6"/> Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file.

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