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BackBump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled socket strip SMD 1x13 1.27mm single row Through hole angled socket strip, 1x27, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x02 2.00mm single row style2 pin1 right Through hole angled pin header, 2x26, 1.27mm pitch, double rows Through hole pin header SMD 1x28 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x09, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x24 1.27mm double row Through hole angled pin header SMD 2x26 2.54mm double row Through hole straight pin header, 2x16, 1.00mm pitch, 2.0mm pin length, double rows Through hole pin header THT 1x27 1.00mm single row style2 pin1 right Through hole angled pin header SMD 1x21 2.54mm single row Surface mounted pin header THT 2x26 2.00mm double row Through hole angled socket strip, 2x15, 1.27mm pitch, double rows Through hole angled socket strip THT 2x08 1.00mm double row Through hole pin header THT 1x37 2.54mm single row (from Kicad 4.0.7!), script generated Through hole angled pin.
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