Labels Milestones
BackPitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J.
- MCV_1,5/3-GF-3.81; number of pins: 11; pin pitch.
- 182.5 78.5 (end 151.1 122.965737 (end 157.807501 128.725.