3
1
Back

DF12 vertical Hirose DF13C SMD, CL535-0405-0-51, 5 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Molex 0.50mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3391, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022503391_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py package for diode bridges, row spacing 7.62 mm (300 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 7x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), body size 6.7x21.88mm.

New Pull Request