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BackExposed pad: 4.5x8.1mm, with thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat No Lead Package (JQ) .
- (end 1.37 2.578 (end 1.33 -1.27 (end -1.33.
- 1.060488e+02 1.855000e+01 vertex -9.463166e+01 9.225620e+01 2.655000e+01.
- Unescape ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1.