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Mm; thermal pad with vias HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF U20E-1), generated with kicad-footprint-generator JST GH series connector, B12B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B06B-JWPF-SK-R (http://www.jst-mfg.com/product/pdf/eng/eJWPF1.pdf), generated with kicad-footprint-generator connector wire 2sqmm double-strain-relief Soldered wire connection, for 2 times 0.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 2.7mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_312051_RT045xxUBLC_OFF-022759T.pdf, script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_TE-Connectivity THT Terminal Block Phoenix PT-1,5-4-3.5-H pitch 3.5mm size 56x7.6mm^2 drill 1.2mm pad 2.4mm Terminal Block Phoenix PT-1,5-11-5.0-H, 11 pins, pitch 3.5mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0610, with PCB locator, 13 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with its distribution of the copyright holder nor the names of its contributors may be used to endorse or promote products derived from this software without specific prior written permission. THIS SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE ARE DISCLAIMED. IN NO EVENT SHALL THE AUTHORS OR COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS OR LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM, OUT OF OR IN CONNECTION WITH THE USE OR INABILITY TO USE THE PROGRAM OR THE USE OR PERFORMANCE OF THIS SOFTWARE. The MIT License (MIT) Copyright (c) 2016-2017 Uber Technologies, Inc. Permission is hereby granted, free of charge, to any person obtaining a copy MIT License.

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