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SIP-3, pitch 2.54mm, package size 62x19.5x14mm, https://silvertel.com/images/datasheets/Ag5400-datasheet-high%20Efficiency-30W-Power-Over-Ethernet-Plus-Module-PoE+PD.pdf DCDC-Converter Silvertel Ag5405 Ag5412 Ag5424 single output DC/DC Murata MGJ2DxxxxxxSC, 19.5x9.8x12.5mm, 5.2kVDC Isolated, 1W, dual output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/B%20CASE/SPEC-EC5BE-V24.pdf DCDC-Converter CINCON EC6Cxx dual or quad would add very little cost even without 1v/oct, could be done with a Work for part through the board, connecting a trace on one side //calculated x value of exact middle of panel after deducting left/right sub-panels // top left [left_edge, 0], // drop to axis [left_edge, -extra_depth], // bottom horizontal rib // h_wall(h=4, l=right_rib_x); // bottom horizontal rib // h_wall(h=4, l=right_rib_x); // middle-bottom h rib // bottom horizontal rib h_wall(h=4, l=right_rib_x); // one more vertical to mount the circuit board to, dead center v_wall(h=4, l=top_row-rail_clearance*2-thickness-15); // PCB holder pcb_holder(h=10, l=top_row-rail_clearance*2-15-thickness, th=1.15, wall_thickness=1); // lower h-rib reinforcer cylinder(r=hole_r, h=thickness*2); echo("Putting a hole with radius: ", hole_r , " at ", width_mm - h_margin; out_row_1 = v_margin+12; row_2 = working_increment*1 + row_1; // special: the right-hand side tries to squeeze 6 rows into the space of 5 out_working_increment = working_increment * 4 / 5; row_1 = v_margin+12; row_2 = working_increment*1 + row_1; row_4 = row_3 + vertical_space/7; row_6 = row_5 + vertical_space/7; row_3 = working_increment*2 + out_row_1; out_row_5 = out_working_increment*4 + out_row_1; //special-case the knob (in mm). If you want wider holes for a single 1 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90325-0012, 12 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0610, with PCB locator, 11 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-794105-x, 9 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator connector wire 1sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 6 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.7mm.

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