3
1
Back

/ QFP256J CASE 122BX (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Sxx-0.1.pdf dc-dc recom buck sip-4 pitch 2.54mm size 15.7x6.5mm^2 drill 1.1mm pad 2.1mm Terminal Block Phoenix MKDS-3-6-5.08, 6 pins, single row Surface mounted pin header THT 2x03 2.54mm double row surface-mounted straight socket strip, 2x29, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header THT 1x18 2.00mm single row style2 pin1 right Through hole pin header THT 2x17 2.54mm double row Through hole straight pin header, 1x02, 2.00mm pitch, 6.35mm socket length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket strip SMD 1x38 2.54mm.

New Pull Request