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BackCL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip THT 1x30 1.00mm single row style2 pin1 right Through hole straight socket strip, 2x39, 2.00mm pitch, double rows Surface mounted socket strip THT 2x12 2.54mm double row surface-mounted straight socket strip, 1x36, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x38 1.27mm double row Through hole angled pin header, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip THT 1x12 1.00mm single row Surface mounted socket strip SMD 1x09 2.00mm single row Surface mounted socket strip SMD 1x30 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x01, 2.54mm pitch, single row style2 pin1.
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