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BackFiles *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 ============================================================= Total unplated holes count 0 Minor.
- -7.0455 7.0455 2.94279 facet normal 0.766706.
- Size: 719 KiB BIN Size: 69 KiB After.
- -0.0570715 0.187549 0.980596 vertex 7.38561 0.180748.