Labels Milestones
BackMm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET MN MOSFET Infineon PLCC, 20.
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