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SSOP56: plastic shrink small outline package; 48 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body (see Atmel Appnote 8826 10-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 505AB (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Quad Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole straight pin header, 2x39, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip SMD 1x18 1.00mm single row Through hole angled pin header, 1x16, 1.00mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x20, 1.00mm pitch, single row style2 pin1 right Through hole angled pin header, 2x37, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight pin.

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