3
1
Back

BM15B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-116-02-xx-DV-PE-LC, 16 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-02A1, example for new part number: A-41791-0009 example for new mpn: 39-30-0060, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.5 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector JST ACH series connector, 502585-0970 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.15 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1510, with PCB cutout, light-direction downwards, see http://www.everlight.com/file/ProductFile/ITR8307.pdf Relay SPST, Finder Type 34.81 (opto relays/coupler), vertical/standing form, see https://gfinder.findernet.com/public/attachments/34/EN/S34USAEN.pdf Relay SPDT, Finder Type34.51, vertical/standing form, see https://gfinder.findernet.com/public/attachments/34/EN/S34USAEN.pdf Hamamatsu spectrometer, see http://www.hamamatsu.com/resources/pdf/ssd/c12880ma_kacc1226e.pdf 3.2mmx2.7mm, light sensor, i2c interface, 6-pin chipled package, http://optoelectronics.liteon.com/upload/download/DS86-2013-0004/LTR-303ALS-01_DS_V1.pdf Optoisolator with LED and photoresistor 3 Lead Plastic Package OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100CY, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic SMD DIL, 4.5x4mm, area: 2.2x2.2mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5989350/BP%20104%20FAS_EN.pdf PhotoDiode, plastic SMD DIL, 4.5x4mm, area: 2.65x2.65mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5467146/SFH%202440_EN.pdf DFN, 6 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/MAX4460-MAX4462.pdf#page=19, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0137.pdf), generated with kicad-footprint-generator Molex Pico-EZmate series connector, 53780-1570 (), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4050, 5 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0140, 14 Circuits (https://www.molex.com/pdm_docs/sd/2005280140_sd.pdf), generated with kicad-footprint-generator Hirose DF63 through hole.

New Pull Request