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**UI:** edits README.md file - Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel power jack 2mm 2.5mm KLDX-0202-BC KLDX-0202-AC 1.10mm Pitch microSD Memory Card Connector, Surface Mount, ZIF, 24 Circuits (https://www.molex.com/pdm_docs/sd/2005280240_sd.pdf), generated with kicad-footprint-generator JST XH series connector, B12B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0410-4-51, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 52991-0208, 20 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator JST SUR side entry boss JST XH series connector, B20B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 1.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0810, with PCB locator, 14 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770190-x, 5 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.25 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Thick Film Chip Resistor Network, ROHM MNR12 (see mnr_g.pdf Precision Thin Film Chip Resistor Network, ROHM MNR35 (see mnr_g.pdf Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf Chip Resistor Network, ROHM MNR04 (see mnr_g.pdf Chip Resistor Network, ROHM MNR14 (see mnr_g.pdf Precision Thin Film Chip.

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