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SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small.

• Connect Type011_RT05504HBWC pitch 5mm size 45x9mm^2 drill.
• For file Images/precadsr-panel.png master PSU/Synth.
• 45.7x8.3mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see.

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