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THT 2x18 2.54mm double row Through hole angled pin header THT 1x16 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x36 1.00mm double row surface-mounted straight pin header, 1x22, 1.00mm pitch, 2.0mm pin length, double rows Through hole IDC header, 2x30, 1.00mm pitch, double rows Through hole angled pin header THT 1x07 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x17, 1.00mm pitch, double rows Through hole angled pin header, 1x20, 1.27mm pitch, 3.9x4.9mm body, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL115A1.pdf#page=15), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [QFN] with thermal pad HTSSOP32: plastic thin shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 48 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-92 leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 56 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [QFN] with thermal pad TSSOP HTSSOP 0.65 thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x11 2.00mm double row Through hole angled pin header THT 1x13 2.00mm single row Through hole pin header SMD 1x23 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x29 2.54mm single row Through hole angled pin header, 2x22, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x06 1.00mm double row Through hole straight pin header, 1x03, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x25 1.00mm single row Through hole straight pin header, 2x09, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip SMD 1x32 2.54mm single row (from Kicad 4.0.7!), script generated Surface mounted pin header SMD 1x05.

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