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"Source Code Form" means the Contributions of others (if any) used by Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package (MF) - 3.3x3.3x1 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic QFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (JEDEC MO-153 Var HB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, AFC07-S06FCA-00, 6 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic.

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