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LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition.

• PG-TISON-8-5, 8x8x1.1mm, 1mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-5/ VML0806.
• Normal -0.773981 -0.633208 0 facet normal -0.772567 -0.634832.
• 0.952377 0.0975456 facet normal 0.0348077 0.996914 -0.0703583 facet.

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