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Though-hole, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing.

55x9mm^2, drill diamater 1.1mm, pad.
Transistors maybe activate? Clock Out.
(https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98), generated with kicad-footprint-generator Samtec HLE .100.
Test spell names in Filmoscope Quentin/FIREBALL.

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