Labels Milestones
BackSpacing 16.51 mm (650 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads THT DIP DIL ZIF 25.4mm 1000mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size.
- See http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 2.54mm TO-247-4.
- B11a8d3187 Go to file.
- HLE-120-02-xxx-DV-BE-LC, 20 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN.