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These gaps reduce heat conduction during soldering - ground plane Change transistor footprint to inline_wide, fix DRC ground plane Binary files a/3D Printing/Panels/FIREBALL VCO.png | Bin 0 -> 11692 bytes .../HOLD PORTAL.png | Bin 0 -> 11675 bytes .../FIREBALL VCO.png | Bin 0 .

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