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Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x23 1.27mm single row style2 pin1 right Through hole angled pin header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip THT 2x05 1.27mm double row surface-mounted straight pin header, 1x03, 2.00mm pitch, 4.2mm pin length, single row style2 pin1 right Through hole horizontal IDC box header, 2x30, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header, 2x29, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x04 2.54mm single row Through hole.

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