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(LZ) - 2x3x0.9 mm Body [HTSSOP], with thermal pad LQFP, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation.

• 12 bump 4x3 grid, NSMD pad definition Appendix.
• -0.560089 -0.682464 0.46962 facet normal -0.586516.

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