Labels Milestones
BackSpartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (JEDEC.
- Artix-7 BGA, 26x26 grid, 27x27mm package.
- 502443-0470 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with.