3
1
Back

Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole IDC header, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip SMD 1x12 1.27mm single row Through hole angled socket strip, 2x26, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x13 1.00mm double row SMD IDC box header, 2x15, 2.54mm pitch, double rows Through hole straight Samtec HPM power header series 11.94mm post length THT 1x06 2.00mm.

New Pull Request