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LAN Transformer 10/100BaseT (https://katalog.we-online.de/pbs/datasheet/74980111211.pdf 36pin mini SAS connector, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=1888174&DocType=Customer+Drawing&DocLang=English Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-120-xx.x-x-DV-N, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package - 3x3 mm Body [TSSOP] with exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (https://ww2.minicircuits.com/case_style/DQ1225.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 1, Wuerth electronics 9774050243 (https://katalog.we-online.de/em/datasheet/9774050243.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-20DP-2DSA, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5020, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-115-02-xxx-DV-A, 15 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B34B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0170, 17 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 2.5 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Maxim TDFN, 6 Pin.

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