Labels Milestones
Back0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J.
- -0.382468 0.447802 0.808202 facet normal -0.18809.
- 1W, single output, https://assets.tracopower.com/20171102100522/TEN10/documents/ten10-datasheet.pdf.