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See http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 505405-0670 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 505405-0670 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-5140, 14 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with.

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0.0222629 0.0969963 0.995036 facet normal 0.0100873 0.15129.
-0.106559 -0.137901 0.984697 vertex.

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