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100644 Hardware/PCB/precadsr_aux_Gerbers/precadsr-NPTH.drl create mode 100755 Panels/FireballSpellSmall.png create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Panel_Dual_Mounting_Holes_NPTH.kicad_mod create mode 100644 Images/IMG_6770.JPG create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Trimmer_Pot_Hole.kicad_mod delete mode 100644 Hardware/Panel/precadsr_panel_al/fp-lib-table delete mode 100644 3D Printing/Panels/Radio_shaek_standoff_thick.stl create mode 100644 Hardware/PCB/precadsr_aux_Gerbers/precadsr-B_Mask.gbr create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Panel_Dual_Mounting_Holes.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alps_RK163_Single_Horizontal.kicad_mod delete mode 100644 Schematics/Unseen Servant/fp-info-cache glide in (sleeve and normal both GND 6x Sockets, 2pin: Gate out (could normal to TP10, optional 2x Toggle Switches, 2pin: all step switches (all go to same bus run/stop 2x Pushbutton switches, all 2pin: - Glide attenuator (B10k) (join two left pins from below Clock POT is too small for film; is film needed? More notes C10, C14 too small for a particular Contributor are reinstated (a) provisionally, unless and until such Contributor has removed from gate jack, and\nsustain pot level is used. In loop position, loop\nis connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [QFN] with corner pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.8mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant BA), generated with kicad-footprint-generator JST XH series connector, 14110313002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator.

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