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U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A.

1.84727 -9.28685 3.54602 facet normal -0.184972.
6.92908 2.87013 6.0001 vertex -6.92908 -2.87013 6.0001 vertex.
Opening (Level B Circular Fiducial.
-9.991817e-01 vertex -1.063499e+02 9.725134e+01 1.021498e+01.
502250-3991, 39 Circuits (http://www.molex.com/pdm_docs/sd/5022503991_sd.pdf.

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