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Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [HTSSOP], with thermal pad TSSOP.

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