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BackSemiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [HTSSOP], with thermal pad TSSOP.
- -6.727979e-001 7.398263e-001 0.000000e+000 vertex -3.686406e+000 4.246111e+000 2.496000e+001.
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X="5.4" y="2.1"/>
SM-PIC0602H Fixed inductor SMD magnetically. - SPOX Connector System, 43045-2221 (alternative.