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From: https://www.vishay.com/docs/48064/_t58_vmn_pt0471_1601.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Plastic Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic Dual Flat, No Lead Package - 10x10x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket.

70 contacts (polarized Highspeed card edge.
17.15mmx17.15mm, https://sunlordinc.com/Download.aspx?file=L1VwbG9hZEZpbGVzL1BERl9DYXQvMjAyMjExMTUxNDQ4MDU0NTQucGRm&lan=en Inductor, Sunlord, MWSA0624S, 7.0x6.6x2.2mm.
Two, if you want. Latest commits.
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