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1.854mm thermal pad HTSSOP32: plastic thin shrink small outline package; 16 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Common Mode Bead, 4222 4222R, http://www.delevan.com/seriesPDFs/4222.pdf Choke, Drossel, PISN, SMD, Fastron, Choke Drossel PISN SMD Fastron Choke.

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