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XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted socket strip THT 1x39 2.00mm single row Through hole pin header THT 2x13 2.54mm double row Through hole socket strip THT 1x16 2.54mm single row Through hole angled pin header THT 1x15 2.00mm single row Through hole angled pin header SMD 2x26 2.54mm double row Connector IDC Locked, 10 contacts, compatible header: PANCON HE10 (Series 50, (https://www.reboul.fr/storage/00003af6.pdf Through hole socket strip SMD 2x03 1.27mm double row Through hole straight pin header, 2x15, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip, 2x06, 1.00mm pitch, double rows Through hole angled pin header, 2x02, 1.27mm pitch, 4.4mm socket length, double rows Through hole straight socket strip, 2x09, 2.00mm pitch, double rows Through hole angled socket strip THT 1x13 1.27mm single row style2 pin1 right Through hole socket strip SMD 2x31 1.27mm double row surface-mounted straight socket strip, 1x29, 1.00mm pitch, 2.0mm pin length, double.

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