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Rotary switch, 4-bit encoding, 10 positions, Complementary code K rotary hex Gray D 1x DIP Switch, Single Pole Single Throw (SPST) switch with ground pin http://www.ckswitches.com/media/1479/kmr2.pdf tactile push button, 6x6mm e.g. PHAP33xx series, height=8.5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=13mm FS5700 series pushbutton footswitch, DPDT, https://www.e-switch.com/system/asset/product_line/data_sheet/226/FS5700.pdf Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, with Boss Ultra-small-sized Tactile Switch Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch for High-Density Packaging Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89012xx, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 1 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm.

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