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B20B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator connector Harwin M20 side entry boss JST ZE series connector, B30B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 5.9 mm (232 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 8.61 mm (338 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils SMD DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package.

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