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Number: 26-60-5180, 18 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.1 mm² wire, reinforced insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.75 mm² wire, basic insulation, conductor diameter 0.9mm, length 10.0mm, width 2.4mm solder Pin_ press fit solder Pin_ loose fit solder Pin_ with flat fork, hole diameter 1.3mm, wire diameter 1.0mm wire loop with bead as test point, pitch 5.08mm, size 10.2x11.2mm^2, drill diamater 1.1mm, pad diameter 2.6mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_317031_RT10NxxHGLU_OFF-022897S.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT single screw terminal block RND 205-00303 pitch 10mm size 65x10.3mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00074, 9 pins, pitch 5.08mm, size 25.4x8.45mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00287_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type059_RT06302HBWC, 2 pins, pitch 10mm, size 55x10.3mm^2, drill diamater 1.1mm, pad diameter 2.5mm, hole diameter 1.5mm wire loop as test point, loop diameter2.6mm, hole diameter 1.2mm (loose fit), length 11.0mm solder Pin_ with flat with hole, hole diameter 1.0mm wire loop with bead as test point, pitch 2.0mm, hole diameter 1.5mm wire loop with bead as test Point, square 1.5mm side length, hole diameter 1.3mm, hole diameter 0.5mm test point SMD pad as test Point, square 1.5mm side length test point THT pad as test Point.

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