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Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Stretched Small Outline (SS)-5.30 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin.

Normal 0.0559554 -0.885449 0.461356 facet normal 7.480908e-001 6.635964e-001.
-0.181148 -0.338901 0.923218 facet normal -0.758946 0.0816059.
-6.737715e-001 6.246960e-001 vertex -3.471306e+000 2.686626e+000 2.488700e+001.

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