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0.8mm 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 10 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm vertical Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0060, 6 Circuits (https://www.molex.com/pdm_docs/sd/2005280060_sd.pdf), generated with kicad-footprint-generator JST PH series connector, S9B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 13, Wuerth electronics 9774040951 (https://katalog.we-online.de/em/datasheet/9774040951.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 14110613010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-02A2, example for new part number: 26-60-4060, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2118, 11 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 52 pins, through hole 3.2mm, height 8.6, Wuerth electronics 9774070943 (https://katalog.we-online.de/em/datasheet/9774070943.pdf), generated with kicad-footprint-generator Fuse SMD 0402 (1005 Metric.

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