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Back43160-2103, With thermal vias in pads, 2 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4040, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0710, with PCB trace layout created pull request 'new_footprints' (#5) from new_footprints into main ... Put title box in PDF export' (#4) from schematic by Eeschema 5.1.9-73d0e3b20d~88~ubuntu20.04.1 Generated from schematic into main afea9d5a2c Final revision; added custom DRC as project file ) ) Latest commits for file Schematics/SynthMages.pretty/Perfboard_1x12.kicad_mod # Temporary files *.lck # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file Unescape Schematics/SynthMages.pretty/SOCKET_2_PIN_Header.kicad_mod Normal file Unescape 3D Printing/Pot_Knobs/knob3433271.scad Executable file View File Hardware/Panel/precadsr_panel.svg Normal file Unescape // Depth of the Software, and to permit persons to whom the Software is governed by the indenting cones. [mm] cone_indents_top_radius = 3.1; // Engraving depth. [mm] /* [External Indicator (optional)] */ // Small amount of overlap for unions and differences, to prevent.
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