Labels Milestones
BackTSSOP8: plastic thin shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 16 leads; body width 4.4 mm; thermal pad LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT401-1.pdf), generated with.
- Centers of each sliding.
- T2844-1; https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF), generated with.