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Back2.4 GHz Wi-Fi and Bluetooth combo chip Single 2.4 GHz Wi-Fi and Bluetooth combo chip https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32_datasheet_en.pdf Single 2.4 GHz Wi-Fi and Bluetooth module Single 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32d_esp32-wroom-32u_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf NINA-B111 LGA module 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin (JEDEC MO-153 Var CB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator connector Molex PicoBlade Connector System, 53048-0510, 5 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.15 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (https://www.diodes.com/assets/Datasheets/PI6C5946002.pdf#page=12), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 38 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1750.pdf), generated with kicad-footprint-generator JST EH side entry JST GH series connector, S07B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator JST GH series connector, LY20-34P-DLT1, 17 Circuits (http://www.molex.com/pdm_docs/sd/5022501791_sd.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B14B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.15 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST LEA series connector, S36B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3)), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0401, 40 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0210, with PCB locator, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-22DP-2DSA, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.25 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter.
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